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Brand Name : ROYAL
Model Number : RT1000-Ta
Certification : CE
Place of Origin : Made in China
MOQ : 1 set
Price : negotiable
Payment Terms : L/C,T/T
Supply Ability : 5 sets per month
Delivery Time : 8 to 12 weeks
Packaging Details : Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.
Name : Tantalum PVD Sputtering Deposition Machine
Coatings : Tantalum, Gold, Silver etc.
Technology : Pulsed DC sputtering
Application : Microelectronics industry,Medical instruments ,Coatings on corrosion resistant parts,,
Ta film properties : Tantalum is most used in the electronic industry as a protective coating because of its good resistance to erosion.
Factory Location : Shanghai city, China
Worldwide Service : Poland - Europe; Iran- West Asia & Middle East, Turkey, India, Mexico- South America
Training Service : Machine operation, maintenance, coating process Recipes, program
Warranty : Limited warranty 1 year for free, whole life for machine
OEM & ODM : available, we support tailor made design and fabrication
Magnetron Sputtering is widely used to deposit refractory metals like tantalum, titanium, tungsten, niobium, which would require very high temperatures of deposition, and precious metals: Gold and Silver and which is also used for deposition of lower melting points metals like copper, aluminum, nickle, chrome etc.
Tantalum is most used in the electronic industry as a protective coating because of its good resistance to erosion.
Applications of Sputtered Tantalum thin film:
1. Microelectronics industry as the films can be reactively sputtered and thus resistivity and temperature coefficient of resistance can be controlled;
Technical Advantages
Royal Technology’s standardized Tantalum sputtering deposition system:
Main Configurations | |
MODEL | RT1000-Ta |
TECHNOLOGY | Pulsed DC magnetron sputtering Cathodic arc plating (for option, determined by coating process) |
CHAMBER MATERIAL | Stainless Steel (S304) |
CHAMBER SIZE | Φ1000*1000mm (H) |
CHAMBER TYPE | D shape, cylindrical chamber |
ROTATION RACK & JIG SYSTEM | Satellite driving or central driving system |
POWER SUPPLIES | DC Sputtering Power Supply: 2~4 sets Ion Source: 1 set |
DEPOSITION MATERIAL | Ta, Ti/Cr/TiAl, Au, Ag, Cu etc. |
DEPOSITION SOURCE | Planar Sputtering Cathodes + circular arc cathodes |
CONTROL | PLC(Programmable Logic Controller) + IPC ( manual+ auto+ semi-auto operation models) |
PUMP SYSTEM | Rotary Vane Pump: SV300B – 1 set (Leybold) |
Roots Pump: WAU1001 – 1 set (Leybold) | |
Holding Pump: D60C – 1 set (Leybold) | |
Magnetic Suspension Molecular Pump: MAG2200 – 2 sest (Leybold) | |
GAS MASS FLOW CONTROLLER | 2 channels: Ar and N2 |
VACUUM GAUGE | Inficon or Leybold |
SAFETY SYSTEM | Numerous safety interlocks to protect operators and equipmen |
HEATING | Heaters: 20KW. Max. temp.: 450℃ |
COOLING | Industrial Chiller (Cold Water) |
POWER MAX. | 100KW (Approx.) |
AVERAGE POWER CONSUMPTION | 45 KW (Approx.) |
GROSS WEIGHT | T (Approx.) |
FOOT PRINT | ( L*W*H) 4000*4000 *3600 MM |
ELECTRICAL POWER | AC 380V/3 phases/50HZ / 5 line |
Insite:
Built Time: 2018
Location: China
Please contact us for more applications and specifications.
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Tantalum(Ta) Magnetron Sputtering Deposition System-RT1000-Ta Images |